When space, size, and customization constraints necessitate a board-level camera solution, certain drawbacks must be acknowledged. This is particularly relevant in demanding environments such as defense and military applications where cameras are subjected to heavy shocks and vibrations.

Key Concerns:

  • Thermal Management:
    Unlike modular systems, board-level cameras lack the ability to utilize housing as a heat sink, potentially leading to thermal challenges.

  • EMC/EMI Compliance:
    The responsibility for electromagnetic testing shifts entirely to the integrator, as camera suppliers cannot provide shielding solutions.

  • Ruggedization:
    Achieving resistance to shock and vibration becomes significantly more difficult due to limited structural support.

  • Dirt Protection:
    While board-level enclosures effectively exclude dust and moisture, they may not offer the same level of sealing as modular designs.

Potential Solutions:

  1. Preserving Mechanics Around Sensors:
    Maintaining mechanical components near sensors allows for precise mounting by experts while protecting sensitive areas from particle intrusion. However, this approach typically remains suitable only for initial prototypes or less demanding applications, lacking full ruggedization for extreme conditions.

  2. Opting for Remote Sensor Heads:
    A compact remote sensor head camera provides enhanced flexibility and complete ruggedization, making it an ideal choice for overcoming space limitations in electro-optical systems requiring high durability.

Further Information:

For additional details on these solutions, visit us at the Defense, Security, and Sensing 2012 conference. We will be located in booth #1829.

Last Updated: 2025-09-04 19:01:27