Higher resolution cameras paired with increased processing speeds enable manufacturers of PCB inspection equipment to achieve the necessary move to three-dimensional inspections. This advancement is exemplified by recent developments at Foxconn, which highlights the growing consumer appetite for smartphones and tablets.

We’ve previously discussed how higher density chips and smaller packaging techniques drive the performance of modern devices like smartphones and tablets. The push toward miniaturization inevitably extends into PCB manufacturing, creating new obstacles for inspection equipment makers to ensure accuracy and efficiency.

PCB production involves multiple verification steps, including automated optical inspection (AOI) for both boards and components, as well as solder paste inspection (SPI).

Automated Optical Inspection of PCBs and Components

To enhance performance while reducing size, engineers rely on smaller chips, diverse packaging options, denser printed circuit boards, and more complex multi-layered designs. The range of component sizes also adds to the complexity.

3D AOI represents a significant leap over traditional 2D inspection by providing full dimensional measurements that accurately verify component details.

Larger resolution cameras—such as those with 25 Megapixel sensors—are particularly useful for handling diverse components and offering flexible field of view. Even at high resolutions, fast frame rates can be maintained thanks to interfaces like Camera Link deca or CoaXPress (achieving over 32 fps).

For effective 3D inspection, multiple sequential images are required—typically three—to reconstruct the complete 3D information through a specialized algorithm. Maintaining throughput necessitates cameras with high sensitivity and reproducible imaging capabilities that support rapid frame rates.

Solder Paste Inspection

The importance of 3D measurement in SPI has grown alongside changes in solder paste volume. As solder bumps and balls shrink, measuring paste volume becomes more critical than just width dimensions. Since the solder creates essential connections between PCBs, verifying its volume is crucial for ensuring joint reliability—both before and after reflow.

These demanding camera requirements for 3D metrology underscore the need for high-resolution imaging solutions that can support quality control in advanced electronics manufacturing.

High-resolution cameras combined with high speeds enable select image sensors to capture the precise images needed for 3D inspection and measurement, guaranteeing component quality for your latest smartphones and tablets.

Last Updated: 2025-09-04 19:06:48