The SPIE Defense, Security, and Sensing Exhibition serves as a premier forum where developers of cameras, sensors, optics, computers, and integrated systems can showcase their latest innovations specifically tailored to the global security market.

For years, engineers have focused on reducing size, weight, and power (SWaP) for wearable, airborne, and vehicle-based systems. With recent budget constraints in government sectors, this concept has been expanded to SWaP-C by including cost reduction alongside physical and performance factors. This challenge requires balancing advanced capabilities with stringent limitations on size, weight, power consumption, and cost.

The exhibition featured numerous computing and electronics components designed precisely for these demanding requirements. Exhibitors presented solutions aimed at enhancing system performance while meeting the ever-increasing demands of modern security applications.

One notable example was Adimec’s expansion of its TMX-DHD series full HD electro-optical sensor modules. New variants include cube outline (TMX7-DHD) and board-level (TMX7-DHD BLC) options, in addition to the existing remote sensor head design (TMX6-DHD). These ruggedized versions maintain minimized size, weight, power usage, and cost while delivering full HD resolution, extended sensitivity across varying conditions, and vivid color imaging.

These cameras are specifically engineered for critical applications like UAV surveillance systems where precise detection, recognition, and identification capabilities under challenging environmental conditions are essential. The TMX6-DHD rugged, color, HD camera exemplifies this design philosophy with its ability to deliver crisp images in daylight while maintaining performance regardless of the environment.

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Last Updated: 2025-09-04 19:32:54