The Imaging Source will be presenting a comprehensive range of imaging hardware and machine vision solutions at the New International Expo Centre in Shanghai during Vision China Shanghai 2019. This event, held from March 20-22, 2019, at booth W5, 5412, will feature cutting-edge technologies including USB3 Vision standard-compliant USB 3.1 (gen.1) board-level and industrial cameras, as well as the innovative stereo 3D system called IC 3D.

Simplifying Stereo 3D Technology

The stereo 3D system, IC 3D, is designed to make 3D imaging more accessible. It is compatible with a wide variety of TIS industrial cameras and offers exceptional flexibility for diverse applications. At the event, it will be showcased with popular models such as the DFK 33UP1300 and DFK 33GP1300 color industrial cameras.

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Last Updated: 2025-09-05 00:30:37