In today’s rapidly evolving world of industrial automation, machine vision systems are increasingly reliant on cutting-edge imaging technology. Teledyne DALSA, a subsidiary of Teledyne Technologies (NYSE: TDY), is proud to introduce the Linea™ HS2 TDI line scan camera family—a groundbreaking innovation that builds upon more than four decades of expertise in the industry.

Key Features and Technical Specifications

The Linea HS2 series boasts impressive technical capabilities, designed specifically for ultra-high-speed imaging in challenging light-starved environments. With a resolution of 16k/5 µm, this camera achieves exceptional image quality while maintaining an unprecedented maximum line rate of 1 Megahertz or 16 Gigapixels per second data throughput—setting a new benchmark in the industry.

At its core, the Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor, optimized for Quantum Efficiency to meet the rigorous demands of current and future machine vision applications. This advanced architecture allows users to configure cameras specifically for superior image quality with maximized line rate, dynamic range, or full well capacity—tailoring performance to exact application requirements.

This versatility makes the Linea HS2 particularly suitable for demanding industries including semiconductor wafer inspection, high-density interconnects, flat panel displays, and life science applications. The camera’s on-chip binning capability further enhances system throughput by enabling higher web speeds, while dual Camera Link HS CX4 connectors to Active Optical Cables ensure complete electromagnetic immunity.

Seamless Integration and Performance Enhancements

Designed as a natural upgrade from Teledyne’s existing Linea HS line scan cameras, the new model maintains compatibility with established pixel size, optics, cables, and mounting hardware. Significantly, it offers a 2.5x increase in speed while keeping power consumption reasonable—making the transition straightforward for current users.

For applications requiring precise thermal management during operation, an optional liquid cooling accessory provides enhanced stability without compromising performance.

Comprehensive Solution Architecture

When integrated with Teledyne’s Xtium2 CLHS series frame grabbers, utilizing advanced CLHS technology, the Linea HS2 delivers exceptional data throughput of 16 Gigapixels per second over dual CX4 connectors to active optical cables. This robust system supports parallel data processing across up to 12 PCs—offering a complete solution for complex imaging requirements.

Availability and Support

For hands-on demonstrations, visit Teledyne’s presence at the VISION trade show in Stuttgart (October 8-10, 2024) on booth 8 B10. Alternatively, explore detailed product specifications through our online resources. For tailored solutions or technical inquiries regarding machine vision systems and components, we invite you to visit our contact page.

About Teledyne DALSA

As part of Teledyne’s Vision Solutions group, Teledyne DALSA leads the industry in designing, manufacturing, and deploying digital imaging components for machine vision applications worldwide. Their comprehensive portfolio—including image sensors, cameras, frame grabbers, software, and specialized vision solutions—powers thousands of inspection systems across multiple industrial sectors.

To learn more about Teledyne’s complete range of visual technologies and their impact on modern automation, visit www.teledynevisionsolutions.com/.

Last Updated: 2025-09-05 04:11:14