Teledyne e2v, a subsidiary of Teledyne Technologies (NYSE: TDY), is proud to sponsor and present at the upcoming European Machine Vision Association (EMVA) 21st Business Conference. The conference will take place from May 4-6 in Seville, Spain.

Rafael Romay Juárez, Executive Vice President and General Manager of Teledyne’s CMOS image sensors and aerospace & defense groups, will deliver a presentation titled 3D Stacked Technologies applied to Custom CMOS Image Sensors – A very solid reason to invest in differentiation. In this talk, he will discuss how modern 3D stacked technologies can be leveraged to create next-generation CMOS image sensors capable of effectively addressing inspection challenges while significantly improving the SWaP-C (Size, Weight, Power, and Cost) of inspection systems.

Romay holds a double Master’s degree in Microelectronics System Design and Computer Science from the University of Seville. After completing research on high-speed data converters at Spain’s National Research Council (CNM-CSIC), he joined Bell Labs as a Design Engineer. In 2001, he became part of AnaFocus—a start-up specializing in CMOS image sensors based in Seville—serving as Business Development Director and CEO until the company was acquired by e2v in 2014. Teledyne Technologies (TDY) subsequently acquired e2v in 2017.

The EMVA Conference brings together business leaders and technical experts from across Europe and worldwide to discuss industry trends and challenges. The 21st iteration features a packed agenda with cutting-edge talks alongside numerous networking opportunities for those shaping the future of machine vision. Key topics include artificial intelligence, spectral imaging, OpenCV, event-based imaging, custom CMOS sensors, and addressing HR-related challenges.

For more details or to register, visit the conference webpage. To learn more about Teledyne e2v’s CMOS image sensors, please visit https://imaging.teledyne-e2v.com/ .

Last Updated: 2025-09-05 04:26:20