Orlando, Florida – May 2-4, 2023

Teledyne will showcase cutting-edge products and solutions at the upcoming SPIE’s Defense and Commercial Sensing exhibition. Visitors to booth #1003 can meet representatives from Teledyne FLIR’s OEM, Optics, and R&D Solutions groups, as well as experts from Teledyne’s DALSA, e2v, Judson, and Princeton Instruments businesses.

  • Teledyne DALSA: Showcasing ISR solutions featuring one-dimensional and two-dimensional multispectral TDI/hyperspectral arrays for visible, SWIR, and MWIR wavelengths.
  • Teledyne FLIR R&D Solutions: Highlighting Research Studio Professional Edition v.3.0 with enhanced user calibrations, advanced measurement functions, and an emissivity calculator.
  • Teledyne FLIR OEM: Demonstrating the expanded Boson+ LWIR camera module line for radiometric applications.
  • Teledyne Princeton Instruments: Featuring COSMOS® large-format, deep-cooled CMOS cameras ideal for demanding imaging tasks.
  • Teledyne e2v: Showcasing CHROMA-D UV-SWIR sensors, the CIS120 image sensor, and the multispectral qTDI CMOS CIS125 sensor.
  • Teledyne Judson Technologies: Displaying infrared detectors for defense, military, space, and commercial applications.

Keynote Presentations

  • May 1, 2023 (EDT):

    • “Understanding the 5 S’s of IR Detector Selection” by Jeff Koon from Teledyne FLIR R&D Solutions.
    • “MicroCalibir: A Core Module for Multipurpose Applications” by Jean Brunelle from Teledyne DALSA.

  • May 3, 2023 (EDT):

    • “Hyperspectral Imaging in the Infrared” by Paul Mark from Teledyne Judson Technologies.
    • “Computational Imaging in Defense Electro Optical Systems” by Arthur Stout from Teledyne FLIR.

  • May 4, 2023 (EDT):

    • “Uncooled IR Open Customizable Platform for Multipurpose Applications” by Jean Brunelle from Teledyne DALSA.

About Teledyne and Their Expertise

Teledyne is a global leader in advanced technology, combining decades of expertise across aerospace, industrial inspection, scientific research, spectroscopy, radiography, radiotherapy, geospatial surveying, MEMS, and semiconductor solutions. The company’s collective strengths enable them to deliver comprehensive sensing technologies with worldwide support tailored for complex challenges.

Media Enquiries:
Debby Flint-Baum
[email protected]

Last Updated: 2025-09-05 04:32:10