Trenton, NJ, USA – January 24, 2024

Teledyne will debut its latest products and solutions at the SPIE’s Photonics West exhibition, taking place from January 30 to February 1 in San Francisco. Visitors can explore innovations from Teledyne’s Imaging group, including its subsidiaries: Teledyne DALSA, e2v, FLIR IIS, Acton Optics, Judson Technologies, Lumenera, Photometrics, and Princeton Instruments.

New Product Highlights

  • Teledyne e2v introduces the OnyxMax™ CMOS image sensor. This next-generation low-light sensor operates effectively down to 1 mLux, combining sensitivity with high resolution for detecting small objects in challenging conditions. It is ideal for applications such as scientific research, defense systems, traffic monitoring, broadcasting, surveillance, border security, and astronomy.

  • Teledyne Photometrics releases the Retiga E9 camera, featuring Sony’s stacked CMOS sensor technology. The E9 captures detailed images from tens of microseconds to tens of minutes with minimal noise. Its 3.76 µm square pixel array and dynamic range exceeding 80 dB deliver high sensitivity and versatility for benchtop or integrated use.

  • Teledyne FLIR IIS presents the Dragonfly® S USB3 series, designed to streamline imaging application development. This modular camera is lightweight and compact, ideal for large-scale manufacturing, volume-based deployments, and multi-camera systems.

Expert Insights

Attendees can learn about hyperspectral imaging, spectroscopy advancements, CMOS detector applications, thermal sensitivity requirements, 3D sensor comparisons, and more. Product specialists will address specific technical needs on-site.

Teledyne Vision Solutions combines expertise across the imaging spectrum to deliver a comprehensive portfolio of best-in-class solutions. By integrating strengths from Teledyne DALSA, e2v, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, and Acton Optics, they provide advanced technologies including image sensors, optical modules, Time-of-Flight (ToF) sensors, line scan cameras, area scan cameras, 3D profiling systems, thermal imaging platforms, and AI-driven vision systems.

These solutions serve diverse industries such as industrial inspection, scientific research, spectroscopy, and semiconductor manufacturing. Teledyne offers global technical support to tackle complex challenges and provide competitive advantages through innovative vision technologies.

Editorial Contact:
Debby Flint-Baum
[email protected]

Last Updated: 2025-09-05 04:35:39