Waterloo, Canada – December 1, 2020 – Teledyne Imaging, a division of Teledyne Technologies (NYSE: TDY), the global leader in vision solutions, is pleased to announce the successful conclusion of its multi-session virtual event focused on introducing cutting-edge imaging technologies for machine vision. The online sessions featured expert-led discussions covering AI and embedded vision, high-resolution and high-speed imaging, 3D sensing, non-visible and multi-spectral imaging, as well as advancements in CMOS sensor technology.

Over three days with six sessions, the virtual event garnered more than 2,200 registrations from attendees across North America, Europe, and Asia Pacific. Dale Deering, Director of Market Development at Teledyne Imaging, commented: “We couldn’t be more pleased to offer these sessions, proving that individuals are eager to engage online for learning about innovative technologies even in the absence of physical trade shows.” He added, “With such overwhelming success, we plan to host this showcase again next year.”

Recordings of all six sessions are available here:

  • Clarity at High Speed – Performance Imaging
  • Connection is everything – Camera/Data Interfaces
  • AI & Embedded Vision – Driving System Innovation
  • New Advances in 3D Sensing
  • Beyond Sight! Non-Visible and Multi-Spectral Imaging
  • Evolving CMOS Sensor Technology

For access to the recordings and a preview of the new imaging technologies, visit teledyneimaging.com/ntsvision2020. These resources are designed to help engineers and developers build the next generation of vision systems.

About Teledyne Imaging

Teledyne Imaging encompasses leading-edge companies united under the Teledyne Technologies umbrella. Collectively, they offer an unrivaled portfolio of expertise across various imaging technologies, from aerospace and industrial inspection to scientific research and advanced semiconductor solutions. With decades of experience combined into one cohesive group, Teledyne Imaging provides world-class support for complex technical challenges in fields including spectroscopy, radiography, geospatial surveying, and MEMS technology.

For additional information about Teledyne Imaging’s capabilities, visit www.teledyneimaging.com.

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Jessica Broom
Senior Global Marcomm Manager
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Last Updated: 2025-09-05 05:05:41