WATERLOO, Ontario – October 18, 2020

Teledyne DALSA, a Teledyne Technologies company listed on the NYSE as TDY and recognized globally for its digital X-ray image sensing technology, is pleased to announce participation in the CMEF 2020 Technical Exhibition. The event runs from October 19-22 at the Shanghai Fair Grounds in China, where Teledyne DALSA will be located in booth #4.1C27.

The company will demonstrate its proprietary software for generic tomosynthesis reconstruction. This technology supports various imaging geometries and scanning methods, enabling X-ray tomosynthesis imaging modalities that accelerate detector integration and open new avenues for system-level innovation.

Additionally, Teledyne DALSA is committed to providing exceptional support to its customers and technology partners. Event attendees are invited to visit the Teledyne DALSA booth to explore the latest developments in medical imaging.

Location: Hall 4, Booth #4.1C27
Dates: Monday October 19-22

About Teledyne DALSA’s Life Sciences Products and Services: Teledyne DALSA operates as part of the Teledyne Imaging group, offering cutting-edge image sensing, capture, and processing solutions to manufacturers in the medical, dental, and scientific sectors. Leveraging over three decades of expertise and innovation, our team specializes in delivering leading-edge product designs tailored to meet stringent quality, reliability, and traceability standards required by the medical and scientific X-ray industry.

For further details, please visit: http://teledynedalsa.com/imaging/markets/medical/

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Trademark information belongs to respective companies.
Teledyne DALSA reserves the right to modify this announcement without prior notice.

Media Contact:
Winnie Xu
Teledyne Professional Imaging Sensors
Email: [email protected]
Phone: +8613564269809

Sales Contact:
[email protected]

Last Updated: 2025-09-05 05:08:03