Waterloo, Canada – June 23, 2020

Teledyne DALSA, a subsidiary of Teledyne Technologies (NYSE: TDY), has unveiled its latest innovation in machine vision technology—a compact 512-pixel short-wave infrared (SWIR) line scan camera. This newest addition to the Linea SWIR series is equipped with an advanced InGaAs sensor and is designed for applications such as food inspection, recycling processes, mineral sorting, and silicon wafer analysis.

Key Features

  • Exceptional Responsivity: Delivering superior sensitivity even beyond visible light wavelengths
  • Low Noise Performance: Ensuring high-quality image data without interference from unwanted signal noise
  • High-Speed Imaging Capabilities: Featuring 25 µm pixel pitch and a line rate of up to 40 kHz, enabling fast object inspection

Advanced Functionality

The camera supports multiple modes including HDR (High Dynamic Range) for capturing scenes with varying light levels. It also includes programmable I/Os for flexible integration into automated systems, Power over Ethernet (PoE) capabilities reducing cabling complexity, and Precision Time Protocol (PTP) for synchronized imaging in multi-camera setups.

Webinar Announcement

To delve deeper into the technical aspects of this camera model join our webinar titled “Introduction to Linea SWIR line scan” scheduled for Tuesday, June 30th at 9 am EDT. Learn about its extensive feature set and real-world applications designed specifically for seeing through obstructions or beyond standard spectral ranges.

Technical Specifications

  • Sensor Type: InGaAs
  • Pixel Pitch: 25 µm
  • Line Rate: Up to 40 kHz
  • Interface: GigE Vision
  • Modes Supported: HDR, Cycling
  • Connectivity Options: Programmable I/Os, Power over Ethernet (PoE)

For detailed product specifications and high-resolution images please refer to our online media kit available on the Teledyne DALSA website.

About Teledyne DALSA

Teledyne DALSA operates at the forefront of machine vision technology providing complete imaging solutions from sensors through software. Their products are integral components in thousands of automated systems spanning industries including semiconductor manufacturing, electronics assembly, automotive quality control medical diagnostics packaging operations and general industrial automation worldwide.

Teledyne Imaging represents a strategic alliance under Teledyne Technologies bringing together expertise from various sectors to deliver comprehensive imaging capabilities across multiple domains including aerospace scientific research industrial inspection radiography geospatial applications MEMS development spectroscopy analysis semiconductor fabrication among others. This collective strength positions Teledyne as a global leader in advanced imaging technologies with worldwide support networks dedicated technical assistance competitive product offerings designed for diverse challenging applications requiring precision reliability innovation expertise scale flexibility combined together

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Teledyne DALSA reserves the right to modify specifications or discontinue products at any time without prior notice.

Last Updated: 2025-09-05 05:13:47