Grenoble, France – April 28, 2020 – Teledyne e2v, a company within the Teledyne Technologies [NYSE: TDY] group and a global leader in imaging solutions, today announced the launch of its new Emerald 3.2 Megapixel CMOS image sensor. This innovative device is specifically designed to address the challenges posed by emerging applications such as security systems, drones, and embedded vision technologies, while also supporting traditional machine vision requirements.

Key Features and Design

The Emerald 3.2M sensor boasts a 2.8 µm global shutter pixel size and an advanced design that retains all the hallmark characteristics of the Emerald series: exceptional low-noise performance, compact form factor, ease of integration, and a wide array of embedded features.

To tackle issues related to optimizing Size, Weight, Power, and Cost (SWaP-C), the sensor is housed in an ultra-compact light package with minimal power consumption. Its MIPI interface enables seamless connectivity with low-cost MIPI ISPs, while its central optical design helps minimize camera size. The small pixel pitch allows the sensor to be paired with compact and cost-effective S-mount optics.

Furthermore, the Emerald 3.2M is pin-to-pin and optically compatible with the Emerald 2M and Emerald 5M sensors. This compatibility ensures that a single design can support multiple resolutions, significantly reducing development costs.

Versatility and Availability

The sensor is available in two packaging options—ceramic LGA or organic fan-out BGA—which cater to different needs for size optimization and robustness in challenging environments. Its flexibility regarding Chief Ray Angle (CRA) ensures compatibility with a variety of optical systems.

This new addition enhances Teledyne e2v’s Emerald product line, which now offers sensors ranging from 2 to 67 megapixels in resolution.

Contact Information

For media inquiries:
[email protected] | +44 (0)1245 453607

About Teledyne e2v and Teledyne Imaging

Teledyne e2v, part of the Teledyne Imaging Group under Teledyne Technologies [NYSE: TDY], specializes in developing innovative imaging solutions tailored to customer needs across industries such as healthcare, life sciences, space, transportation, defense, security, and industrial applications.

As a component of the broader Teledyne Imaging collective—a group of leading-edge companies united under the Teledyne umbrella—Teledyne e2v leverages decades of expertise to deliver best-in-class imaging technologies worldwide. From aerospace and industrial inspection to radiography and radiotherapy, geospatial surveying, and semiconductor solutions, Teledyne’s tools provide cutting-edge capabilities for even the most demanding tasks.

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Last Updated: 2025-09-05 05:16:31